Hot Melt Patch Adhesive
Hot-melt SMD Adhesive
Comparison
The first generation of hot melt patch adhesive
The first generation of hot-melt patch adhesives is based on mass-production patch requirements. In the design, customers are required to design special pads for printed circuit boards. While printing the solder paste, brush the solder paste on the position of the pad. The hot-melt patch glue can be placed in an accurate position. For customers who consider hot-melt patch adhesives and mass production in the design of printed circuit boards from the beginning. This is the most economical application method.
In order to facilitate the customer’s application of heat-capacity patch adhesives, we have developed the second-generation product with its own adhesive layer. In addition to maintaining the performance of all the first-generation SMT adhesives, products with adhesive layers eliminate the need for customers to add pads on the printed circuit board. Customers can design and use hot-melt iron sheet glue on existing printed circuit boards. This makes initial research and development and small batch trial production possible for customers.
The first generation of hot melt patch adhesive
