Application Scenarios
Replace the Underfill by Underfilm friendly
The Underfilm is great renovation to replace the Underfill, by saving those equipment, process and rework issue.
Underfilm is SMT friendly that will use same pick-place machine to apply it easily.
Re-Work could be done efficiently also in case to save the material.
Bottom Fill by Underfilm
To perform better in drop test and proven the micro-crack, bottom fill is the way to do. Underfilm could be placed and melt to fill. Years of application of our Underfilm to pass the test, Temperature Shock and AOL
Hot Bar Joint Bonding
When you feel the weakness of less bonding strength between Rigid PCB and FPC, our Underfilm could help allot. Place any shape Underfilm will increase the bonding force.
ENCAPSULANT
Encapsulation on those sensitive component become easier by SMT pick and place the Underfilm, then pass the reflow over.
Please send your drawing
Every application veris as the board and component design. Please share your application and drawing. Our application engineer will make sure our recommended Underfilm best fit your need.
Click to download the information form,
we will design a patch glue that meets your needs
