Underfilm Technology
OUR UNDERFILM
Hot Melt Patch
Adhesive Comparison
The 1st generation of Underfilm
The 1st generation of Underfilm is designed for massive scale in production. That require tacky pad on the location where you place the Underfilm on for secure the desired position. Once the solder paste are printed with all rest of points, the Underfilm could place on.
This is a low cost version.
The 2nd generation of Underfilm
Our 2nd generation of Underfilm ware introduce for those customer who have PCB design and want to run the Underfilm without change the PCB board. This version come with a micro adhesive dot preload on the back of Underfilm.Therefore the Tacky Pad no longer need. The SMT machine pick and place the Underfilm on the position wherever you want to and stay there.
This will cost little bit more but save you time and expense to change the board.
THE ADVANTAGES
Highlights of hot melt patch adhesive
Replace the most of Underfill, but no need the curing oven.
Provide better anti-shocking and improve the dropping test performance.
Easy re-work when it need to save allot of materials.
Easy customized the characteristics as well as the shape and size.
