Due to the current worldwide environmental protection (RoHS) requirements, the microelectronics industry generally adopts lead-free technology in soldering technology. However, the brittleness of lead-free soldering materials has increased, and the miniaturization and fine gaps of the solder joints of electronic devices have led to a large number of defects in the soldering assembly during the heat treatment process cycle. In particular, due to the increased brittleness of lead-free solders and the accumulation of defects in soldering To balance the thermal stress, when the final product is dropped or oscillates, the local solder joints will produce micro cracks, which may cause poor signal or even failure of the whole machine. The current dispensing technology has the disadvantages of inefficiency and non-rework.<\/p>\n","protected":false},"excerpt":{"rendered":"
Due to the current worldwide environmental protection (RoHS) requirements, the microelectronics industry generally adopts lead-free technology in soldering technology. However, the brittleness of lead-free soldering materials has increased, and the miniaturization and fine gaps of the solder joints of electronic devices have led to a large number of defects in the soldering assembly during the …<\/p>\n