{"id":1052,"date":"2021-05-25T15:08:28","date_gmt":"2021-05-25T07:08:28","guid":{"rendered":"http:\/\/aunderfilm.pcnet.com.cn\/application-scenarios"},"modified":"2021-06-02T17:26:13","modified_gmt":"2021-06-02T09:26:13","slug":"application-scenarios","status":"publish","type":"page","link":"http:\/\/www.a-underfilm.com\/en\/application-scenarios","title":{"rendered":"Application Scenarios"},"content":{"rendered":"\t\t
The Underfilm is great renovation to replace the Underfill, by saving those equipment, process and rework issue.<\/p>
Underfilm is SMT friendly that will use same pick-place machine to apply it easily.<\/p>
Re-Work could be done efficiently also in case to save the material.<\/p>\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
To perform better in drop test and proven the micro-crack, bottom fill is the way to do. Underfilm could be placed and melt to fill. Years of application of our Underfilm to pass the test, Temperature Shock and AOL<\/p>\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
When you feel the weakness of less bonding strength between Rigid PCB and FPC, our Underfilm could help allot. Place any shape Underfilm will increase the bonding force.<\/p>\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
Encapsulation on those sensitive component become easier by SMT pick and place the Underfilm, then pass the reflow over.<\/p>\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
Every application veris as the board and component design. Please share your application and drawing. Our application engineer will make sure our recommended Underfilm best fit your need.<\/p>\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t